RAPID THERMAL CURING OF BCB DIELECTRIC

被引:41
作者
GARROU, PE
HEISTAND, RH
DIBBS, MG
MAINAL, TA
MOHLER, CE
STOKICH, TM
TOWNSEND, PH
ADEMA, GM
BERRY, MJ
TURLIK, I
机构
[1] MCNC,ADV PACKAGING TECHNOL PROGRAMS,RES TRIANGLE PK,NC
[2] MCNC,CTR MICROELECTR,RES TRIANGLE PK,NC
[3] DOW CHEM CO USA,TECH SERV & DEV ACT,MIDLAND,MI 48640
[4] MICROELECTR CTR N CAROLINA,ADV PACKAGING TECHNOL GRP,TECH STAFF,RES TRIANGLE PK,NC
[5] DOW CHEM CO USA,ELECTR APPLICAT GRP CENT RES & DEV,MIDLAND,MI 48640
[6] DOW CHEM CO USA,DEPT RESINS PROD,MICROELECTR TECH SERV,DEV GRP,MIDLAND,MI 48640
[7] DOW CHEM CO USA,ADV MAT GRP CENT RES & DEV,MIDLAND,MI 48640
来源
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1993年 / 16卷 / 01期
关键词
D O I
10.1109/33.214859
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper demonstrates the feasibility of rapid thermal curing (RTC) of benzocyclobutene (BCB) thin films using an infrared belt furnace. The effects on film properties resulting from a dramatic reduction in cure time (5 h to 5 min) are summarized. The extent of cure was determined by FTIR and was subsequently modeled as a function of reaction kinetics using the measured temperature profiles. FTIR spectra from the RTC films were identical to those obtained using a conventional inert gas oven and a convectively heated belt furnace, indicating that: 1) the polymerization mechanisms and the resulting polymer network structure are identical, and 2) no chemical enhancement of the curing occurs due to the absorption of infrared radiation. There are no statistically significant differences in the resulting stress and adhesion properties for samples cured by the RTC process versus the conventional process for film thicknesses ranging from 1-24 mum. Planarization measurements, made on isolated features up to 100 mum in width, also indicate no differences in the cured films.
引用
收藏
页码:46 / 52
页数:7
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