EFFECT OF DEPOSITION PARAMETERS ON STRUCTURE AND RESISTIVITY OF MOLYBDENUM FILMS

被引：26

作者：

BOSNELL, JR

VOISEY, UC

机构：

来源：

THIN SOLID FILMS | 1970年 / 6卷 / 02期

关键词：

D O I：

10.1016/0040-6090(70)90067-2

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

收藏

页码：107 / &

相关论文

共 10 条

[1] SOME PROPERTIES OF FERROMAGNETIC AND TRANSITION METAL FILMS PREPARED BY EVAPORATION ONTO LIQUID HELIUM COOLED SUBSTRATES
BOSNELL, JR
[J]. THIN SOLID FILMS, 1969, 3 (04) : 233 - +
[2] BOSNELL JR, TO BE PUBLISHED
[3] ELEKTRONENBEUGUNGS-AUFNAHMEN VON DUNNEN METALLSCHICHTEN BEI TIEFEN TEMPERATUREN
BUCKEL, W
[J]. ZEITSCHRIFT FUR PHYSIK, 1954, 138 (02): : 136 - 150
[4] METASTABLE THIN FILM EPITAXIAL STRUCTURES
CHOPRA, KL
[J]. PHYSICA STATUS SOLIDI, 1969, 32 (02): : 489 - &
[5] FACE-CENTRED CUBIC MODIFICATION IN SPUTTERED FILMS OF TANTALUM MOLYBDENUM TUNGSTEN RHENIUM HAFNIUM AND ZIRCONIUM
CHOPRA, KL
RANDLETT, MR
DUFF, RH
[J]. PHILOSOPHICAL MAGAZINE, 1967, 16 (140): : 261 - &
[6] MATERIALS AND PROCESSES FOR PASSIVE THIN-FILM COMPONENTS
GLANG, R
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1966, 3 (02): : 37 - &
[7] MAGNETIC MOMENT OF TRANSITION METAL ATOMS IN DILUTE SOLUTION AND THEIR EFFECT ON SUPERCONDUCTING TRANSITION TEMPERATURE
MATTHIAS, BT
PETER, M
WILLIAMS, HJ
CLOGSTON, AM
CORENZWIT, E
SHERWOOD, RC
[J]. PHYSICAL REVIEW LETTERS, 1960, 5 (12) : 542 - 544
[8] MEADEN GT, 1966, ELECTRICAL RESISTANC
[9] A BRIEF REVIEW OF STATE OF ART AND SOME RECENT RESULTS ON ELECTROMIGRATION IN INTEGRATED CIRCUIT ALUMINUM METALLIZATION
SPITZER, SM
SCHWARTZ, S
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1969, 116 (10) : 1368 - &
[10] YOUNG AS, 1968, 4 P INT VAC C MANCH, P496