WXN1-X ALLOYS AS DIFFUSION-BARRIERS BETWEEN AL AND SI

被引：46

作者：

SO, FCT ^{[1
]}

KOLAWA, E ^{[1
]}

ZHAO, XA ^{[1
]}

PAN, ETS ^{[1
]}

NICOLET, MA ^{[1
]}

机构：

[1] CALTECH,PASADENA,CA 91125

来源：

关键词：

D O I：

10.1063/1.341579

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：2787 / 2789

页数：3

共 13 条

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[2] INVESTIGATION OF REACTIVELY SPUTTERED TIN FILMS FOR DIFFUSION-BARRIERS
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[J]. THIN SOLID FILMS, 1986, 136 (02) : 195 - 214
[3] SPUTTERED W-N DIFFUSION-BARRIERS
KATTELUS, HP
KOLAWA, E
AFFOLTER, K
NICOLET, MA
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (06): : 2246 - 2254
[4] KATTELUS HP, IN PRESS DIFFUSION P
[5] KOLAWA E, 1987, TUNGSTEN OTHER REFRA, V2, P311
[6] Moriya T., 1986, Tungsten and Other Refractory Metals for VLSI Applications. Proceedings of the 1985 and 1984 Workshops, P21
[7] DIFFUSION-BARRIERS IN LAYERED CONTACT STRUCTURES
NICOLET, MA
BARTUR, M
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1981, 19 (03): : 786 - 793
[8] GENERAL-ASPECTS OF BARRIER LAYERS FOR VERY-LARGE-SCALE INTEGRATION APPLICATIONS .2. PRACTICE
NOWICKI, RS
NICOLET, MA
[J]. THIN SOLID FILMS, 1982, 96 (04) : 317 - 326
[9] PARK KH, 1987, TUNGSTEN OTHER REFRA, V2, P275
[10] ROLAND JP, 1987, TUNGSTEN OTHER REFRA, V2, P419