PYROELECTRIC THIN-FILM SENSORS AND ARRAYS BASED ON P(VDF/TRFE)

被引:41
作者
NEUMANN, N [1 ]
KOHLER, R [1 ]
HOFMANN, G [1 ]
机构
[1] DIAS ANGEW SENSORIK GMBH,D-01069 DRESDEN,GERMANY
关键词
D O I
10.1080/10584589508019366
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
After a short description of the structure and operation of a pyroelectric sensor, the thermal conditions of the sensing element, the thermal-to-electrical conversion and the signal processing of pyroelectric thin film sensors will be represented. By means of the complex normalised current responsivity T-R(j omega, s) and figures of merit M(V), M(I), and M(D), an universal description of the sensor's internal operation is obtained. The influence of electrothermal coupling effects on the dielectric loss of the pyroelectric thin film is also discussed. Substantial requirements to the pyroelectric thin film and the sensor design are derived. A comparison of often used thin film ferroelectrics shows that the application of P(VDF/TrFE) in low cost sensors can be advantageous although the figures of merit are lower. Copolymer film can be easily deposited onto a silicon wafer in post-processing after read out circuit fabrication, for instance by spin coating of a copolymer solution. Furthermore, the very low thermal conductivity provides good thermal insulation between the pyroelectric film and readout circuitry. The chosen P(VDF/TrFE) with a molar content of 70 % VDF shows a spontaneous polarisation of 8 mu Ccm(-2) and a pyroelectric coefficient of 3.5 nCcm(-2)K(-1), a dielectric constant of 8 and a dielectric loss of about 0.018 at 25 degrees C. By a computer simulation, an optimum sensor design was achieved for single-element sensors and linear arrays. The central feature is a self-supporting carrier membrane of Si3N4 (about 150 nm) and SiO2 (500 nn), processed by bottom side etching of silicone wafers covered with a spin coated P(VDF/TrFE) thin film of about (1...2) mu m in thickness. A radiation sensitive area (1x1) mm(2) and (2x2) mm(2) was choosen for the single-element sensor. In the linear array 128 pixels are arranged with a pitch of 100 mu m, the pixel area is (90x100) mu m(2). A CCD read out circuit with gate modulation input structure is used as multiplexer. The specific detectivity D* (500 K, 10 Hz) of the single-element sensor is 3.10(8) cmHz(1/2)W(-1). At a frequency of 40 Hz the linear array shows a NEP of 4.5 nW and a MTF of 0.32 at a spatial frequency of 3 lpmm(-1).
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页码:213 / 230
页数:18
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