LASER-PATTERNED INTERCONNECT FOR THIN-FILM HYBRID WAFER-SCALE CIRCUITS

被引：11

作者：

TUCKERMAN, DB

机构：

来源：

IEEE ELECTRON DEVICE LETTERS | 1987年 / 8卷 / 11期

关键词：

D O I：

10.1109/EDL.1987.26721

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：540 / 543

页数：4

共 18 条

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