SILICON HYBRID WAFER-SCALE PACKAGE TECHNOLOGY

被引:16
作者
JOHNSON, RW
DAVIDSON, JL
JAEGER, RC
KERNS, DV
机构
关键词
D O I
10.1109/JSSC.1986.1052616
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
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收藏
页码:845 / 851
页数:7
相关论文
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