STABILIZED TANTALUM DIFFUSION BARRIER FOR GOLD METALLIZATION SYSTEM

被引：7

作者：

CHRISTOU, A ^{[1
]}

DAY, HM ^{[1
]}

机构：

[1] USN, RES LAB, WASHINGTON, DC 20375 USA

来源：

关键词：

D O I：

10.1007/BF02654544

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：25 / 35

页数：11

共 7 条

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HICKLIN, WH
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[2] STRUCTURE AND THERMAL-STABILITY OF SPUTTERED AU-TA FILMS
CHRISTOU, A
DAY, H
[J]. JOURNAL OF APPLIED PHYSICS, 1973, 44 (08) : 3386 - 3393
[3] CUNNINGHAM JA, 1969, SOLID STATE ELECTRON, V8, P735
[4] QUANTITATIVE X-RAY DIFFRACTION OBSERVATIONS ON STRAINED METAL AGGREGATES
GREENOUGH, GB
[J]. PROGRESS IN METAL PHYSICS, 1952, 3 : 176 - 219
[5] LEPSELTER MP, 1966, 289 BELL LAB RECORD
[6] SIKINA TJ, 1962, P ELECTR COMP C WASH
[7] WALKER GA, 1970, J VAC SCI TECHNOL, V7, P543, DOI [10.1116/1.1315872, 10.1116/1.1315878]