LOW STRESS OXIDE-POLYSILICON SANDWICHED MICROBRIDGES

Residual stresses in thin films have an important bearing on the formation of free-standing microstructures using conventional silicon technology. Thermal processing constraints become even more restrictive when multilayer composite microstructures are required. We report here on the fabrication of silicon dioxide-polysilicon-silicon dioxide-microbridges with low residual stresses on crystalline silicon substrates using appropriate annealing procedures and an anisotropic etch.