DIFFUSION LAYER INTERPRETATION OF INTERACTION OF ELECTROREFINING ADDITION AGENTS

被引：10

作者：

JENNINGS, HS

RIZZO, FE

机构：

[1] USA, TROPIC TEST CTR, COCO SOLO, PANAMA

[2] UNIV TEXAS, DEPT MET ENGN, EL PASO, TX 79968 USA

来源：

METALLURGICAL TRANSACTIONS | 1973年 / 4卷 / 04期

关键词：

D O I：

10.1007/BF02645590

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

引用

页码：921 / 926

页数：6

共 14 条

[1] THE EFFECT OF THIOCOMPOUNDS ON THE STRUCTURE OF COPPER ELECTRODEPOSITS [J].

BARNES, SC .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1964, 111 (03) :296-299

[2] MECHANISM OF ELECTRODEPOSITION AND DISSOLUTION PROCESSES OF COPPER IN AQUEOUS SOLUTIONS [J].

BOCKRIS, JO ;

ENYO, M .

TRANSACTIONS OF THE FARADAY SOCIETY, 1962, 58 (474) :1187-&

[3]

BUTTS A, 1954, COPPER SCIENCE TECHN

[4]

BYALLOZOR SG, 1968, SOV ELECTROCHEM, V4, P521

[5]

FARRELL MA, 1966, PLATING, V64, P1110

[6] THE MECHANISM OF THE REACTION AT A CU/CU-2+ ELECTRODE [J].

HILLSON, PJ .

TRANSACTIONS OF THE FARADAY SOCIETY, 1954, 50 (04) :385-393

[7] ELECTRODE KINETIC PARAMETERS FOR COPPER DEPOSITION ON CLEAN AND SOILED COPPER CATHODES [J].

KARASYK, L ;

LINFORD, HB .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1963, 110 (08) :895-904

[8] ELECTRONIC CONFIGURATION IN ELECTRODEPOSITION FROM AQUEOUS SOLUTIONS .1. THE EFFECT OF IONIC STRUCTURES [J].

LYONS, EH .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1954, 101 (07) :363-375

[9]

LYZLOV YV, 1957, ZH FIZ KHIM+, V31, P2720

[10]

MAIRANOVSKII SG, 1965, SOV ELECTROCHEM, V1, P1128

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