DYNAMIC ASPECTS OF LINEAR ELASTIC FRACTURE-MECHANICS APPLIED TO DIELECTRIC-BREAKDOWN

被引：6

作者：

HONGZHI, D ^{[1
]}

XIUSAN, X ^{[1
]}

HESUN, Z ^{[1
]}

机构：

[1] ACAD SINICA,INT CTR MAT PHYS,SHENYANG 110015,PEOPLES R CHINA

来源：

JOURNAL OF PHYSICS D-APPLIED PHYSICS | 1993年 / 26卷 / 05期

关键词：

D O I：

10.1088/0022-3727/26/5/016

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The dynamic aspects of linear elastic fracture mechanics applied to dielectric breakdown are studied. In the same direction as the fracture mechanics analogue for dielectric breakdown described previously by some researchers, this paper develops the intrinsic, rate-dependent bond breakdown micromechanism to account for the dynamic process of dielectric breakdown. The formulae of conducting microcrack growth rate and lifetime prediction are derived and applied to the experimental data of SiO2 films.

引用

页码：829 / 835

页数：7

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