THERMODYNAMICS OF (CR, MO, NB, TA, V, OR W)-SI-CU TERNARY-SYSTEMS

被引:23
作者
REID, JS
KOLAWA, E
NICOLET, MA
机构
[1] Department of Electrical Engineering, California Institute of Technology, Pasadena
关键词
D O I
10.1557/JMR.1992.2424
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The room-temperature and 700-degrees-C tie lines of the early transition metal-Si-Cu ternary systems have been calculated for the metals Cr, Mo, Nb, Ta, V, and W. The tie lines are determined by considering only binary and elemental phases in observance of strict stoichiometry and zero solid solubility. We find that copper is stable with the majority of transition metal silicides under consideration at 700-degrees-C. The result is relevant to the design of stable copper metallizations for silicon.
引用
收藏
页码:2424 / 2428
页数:5
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