EXCIMER LASER-INDUCED DEPOSITION OF COPPER FROM CU(HFAC)(TMVS)

被引：19

作者：

IZQUIERDO, R

BERTOMEU, J

SUYS, M

SACHER, E

MEUNIER, M

机构：

[1] ECOLE POLYTECH,DEPT GENIE PHYS,MONTREAL,PQ H3C 3A7,CANADA

[2] UNIV BARCELONA,DEPT FIS APLICADA & ELECTR,FIS CAPES FINES LAB,E-08028 BARCELONA,SPAIN

来源：

APPLIED SURFACE SCIENCE | 1995年 / 86卷 / 1-4期

基金：

加拿大自然科学与工程研究理事会;

关键词：

D O I：

10.1016/0169-4332(94)00439-0

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Copper films have been deposited on TiN and fluoropolymer substrates from the KrF excimer-laser-assisted decomposition of Cu(hfac)(TMVS). Using H-2 as the carrier gas, very uniform, shiny metal-like films were deposited with grain size of 50 to 100 nm. XPS measurements show that the precursor is reduced to metallic copper, and that a Cu/C atomic ratio of up to 17 is obtained.

引用

页码：509 / 513

页数：5

共 11 条

[1]

CHIANG CM, 1993, MAT RES S C, V282, P341

[2]

EHRLICH DJ, 1985, SOLID STATE TECHNOL, V28, P81

[3] KRF EXCIMER-LASER PROJECTION PATTERNED DEPOSITION OF ALUMINUM FROM TRIETHYLAMINE ALANE AS ADSORBATE PRECURSOR [J].