TIME-DEPENDENT DIELECTRIC-BREAKDOWN OF THIN SIO2-FILMS

被引:5
作者
HIRAYAMA, M [1 ]
ASAI, S [1 ]
MATSUMOTO, H [1 ]
SAWADA, K [1 ]
NAGASAWA, K [1 ]
机构
[1] MITSUBISHI ELECT CORP,KITAITAMI WORKS,AMAGASAKI,HYOGO 661,JAPAN
关键词
D O I
10.1143/JJAP.20.L329
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:L329 / L332
页数:4
相关论文
共 11 条
[1]  
Anolick E. S., 1979, 17th Annual Proceedings Reliability Physics, P8, DOI 10.1109/IRPS.1979.362864
[2]   EFFECTS OF MATERIAL AND PROCESSING PARAMETERS ON DIELECTRIC STRENGTH OF THERMALLY GROWN SIO2 FILMS [J].
CHOU, NJ ;
ELDRIDGE, JM .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1970, 117 (10) :1287-+
[3]  
Crook D. L., 1979, 17th Annual Proceedings Reliability Physics, P1, DOI 10.1109/IRPS.1979.362863
[4]  
CROOK DL, 1978, IEDM, P444
[5]   EFFECTIVE DEFECT DENSITY FOR MOS BREAKDOWN - DEPENDENCE ON OXIDE THICKNESS [J].
LI, SP ;
MASERJIAN, J .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1976, 23 (05) :525-527
[6]   DIELECTRIC-BREAKDOWN OF SILICON DIOXIDE THIN-FILM CAPACITORS USING POLYCRYSTALLINE SILICON AND ALUMINUM ELECTRODES [J].
ORMOND, DW .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (01) :162-164
[7]   IMPROVED DIELECTRIC RELIABILITY OF SIO2-FILMS WITH POLYCRYSTALLINE SILICON ELECTRODES [J].
OSBURN, CM ;
BASSOUS, E .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1975, 122 (01) :89-92
[8]   DIELECTRIC BREAKDOWN IN SILICON DIOXIDE FILMS ON SILICON .1. MEASUREMENT AND INTERPRETATION [J].
OSBURN, CM ;
ORMOND, DW .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1972, 119 (05) :591-+
[9]   DIELECTRIC-BREAKDOWN PROPERTIES OF SIO2-FILMS GROWN IN HALOGEN AND HYDROGEN-CONTAINING ENVIRONMENTS [J].
OSBURN, CM .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1974, 121 (06) :809-815
[10]   DIELECTRIC BREAKDOWN IN SILICON DIOXIDE FILMS ON SILICON .2. INFLUENCE OF PROCESSING AND MATERIALS [J].
OSBURN, CM ;
ORMOND, DW .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1972, 119 (05) :597-+