THE EFFECTS OF PROCESSING PARAMETERS ON THE MICROSTRUCTURE AND PROPERTIES OF SPUTTER-DEPOSITED TIW THIN-FILM DIFFUSION-BARRIERS

被引：51

作者：

OPAROWSKI, JM ^{[1
]}

SISSON, RD ^{[1
]}

BIEDERMAN, RR ^{[1
]}

机构：

[1] WORCESTER POLYTECH INST,DEPT MECH ENGN,WORCESTER,MA 01609

来源：

关键词：

D O I：

10.1016/0040-6090(87)90192-1

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：313 / 328

页数：16

共 15 条

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[4] HILL M, 1980, SOLID STATE TECHNOL, P53
[5] HOFFMAN V, 1983, SOLID STATE TECH JUN, P119
[6] SPUTTERED W-N DIFFUSION-BARRIERS
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[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (06): : 2246 - 2254
[7] DIFFUSION BARRIERS IN THIN-FILMS
NICOLET, MA
[J]. THIN SOLID FILMS, 1978, 52 (03) : 415 - 443
[8] Nowicki, 1982, GOLD BULL, V15, P21
[9] GENERAL-ASPECTS OF BARRIER LAYERS FOR VERY-LARGE-SCALE INTEGRATION APPLICATIONS .2. PRACTICE
NOWICKI, RS
NICOLET, MA
[J]. THIN SOLID FILMS, 1982, 96 (04) : 317 - 326
[10] STUDIES OF TI-W-AU METALLIZATION ON ALUMINUM
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[J]. THIN SOLID FILMS, 1978, 53 (02) : 195 - 205