EFFECT OF RESIDUAL GASES ON SURFACE-MORPHOLOGY AND MICROSTRUCTURE OF PB-IN-AU FILMS DEPOSITED AT 95-K

被引：5

作者：

HUANG, HCW

BAKER, JM

SERRANO, CM

KIRCHER, CJ

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1981年 / 19卷 / 01期

关键词：

Compendex;

D O I：

10.1116/1.571019

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

LEAD INDIUM GOLD ALLOYS

引用

页码：72 / 79

页数：8

共 8 条

[1] OVERVIEW OF MATERIALS AND PROCESS ASPECTS OF JOSEPHSON INTEGRATED-CIRCUIT FABRICATION [J].

AMES, I .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1980, 24 (02) :188-194

[2] CONDENSATION COEFFICIENT MEASUREMENTS OF H2O, N2O, AND CO2 [J].

BRYSON, CE ;

CAZCARRA, V ;

LEVENSON, LL .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1974, 11 (01) :411-416

[3] FABRICATION PROCESS FOR JOSEPHSON INTEGRATED-CIRCUITS [J].

GREINER, JH ;

KIRCHER, CJ ;

KLEPNER, SP ;

LAHIRI, SK ;

WARNECKE, AJ ;

BASAVAIAH, S ;

YEN, ET ;

BAKER, JM ;

BROSIOUS, PR ;

HUANG, HCW ;

MURAKAMI, M ;

AMES, I .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1980, 24 (02) :195-205

[4]

HONIG PE, 1960, RCA REV, V21, P360

[5] HIGH-RELIABILITY PB-ALLOY JOSEPHSON-JUNCTIONS FOR INTEGRATED-CIRCUITS [J].

HUANG, HCW ;

BASAVAIAH, S ;

KIRCHER, CJ ;

HARRIS, EP ;

MURAKAMI, M ;

KLEPNER, SP ;

GREINER, JH .

IEEE TRANSACTIONS ON ELECTRON DEVICES, 1980, 27 (10) :1979-1987

[6] METALLURGICAL CONSIDERATIONS WITH RESPECT TO ELECTRODES AND INTERCONNECTION LINES FOR JOSEPHSON TUNNELING CIRCUITS [J].

LAHIRI, SK .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1976, 13 (01) :148-151

[7] THERMAL-STABILITY OF PB-ALLOY JOSEPHSON JUNCTION ELECTRODE MATERIALS .1. EFFECTS OF FILM THICKNESS AND GRAIN-SIZE OF PB-IN-AU BASE ELECTRODES [J].

MURAKAMI, M .

JOURNAL OF APPLIED PHYSICS, 1981, 52 (03) :1309-1319

[8] THERMAL STRAIN IN THIN LEAD FILMS .3. DEPENDENCES OF THE STRAIN ON FILM THICKNESS AND ON GRAIN-SIZE [J].

MURAKAMI, M .

THIN SOLID FILMS, 1979, 59 (01) :105-116

← 1 →