ON THE TEMPERATURE-DEPENDENCE OF PLASMA POLYMERIZATION

被引:57
作者
DEUTSCH, H
KERSTEN, H
KLAGGE, S
RUTSCHER, A
机构
关键词
D O I
10.1002/ctpp.2150280206
中图分类号
O35 [流体力学]; O53 [等离子体物理学];
学科分类号
070204 ; 080103 ; 080704 ;
摘要
引用
收藏
页码:149 / 155
页数:7
相关论文
共 14 条
[1]  
BOENIG HV, 1984, ADV LOW TEMPERATURE
[2]   DEPOSITION TECHNIQUES AND APPLICATIONS OF AMORPHOUS-SILICON FILMS [J].
CRAMAROSSA, F ;
CAPEZZUTO, P .
MATERIALS CHEMISTRY AND PHYSICS, 1983, 9 (1-3) :213-233
[3]   MECHANISM OF ETCHING, POLYMERIZATION AND DEPOSITION IN RF (RADIO-FREQUENCY) DISCHARGES [J].
DAGOSTINO, R ;
CAPEZZUTO, P ;
BRUNO, G ;
CRAMAROSSA, F .
PURE AND APPLIED CHEMISTRY, 1985, 57 (09) :1287-1298
[4]  
Deutsch H., 1981, Beitraege aus der Plasma Physik, V21, P279, DOI 10.1002/ctpp.19810210405
[5]  
DEUTSCH H, 1987, SEP BAS MECH PLASM E
[6]  
DEUTSCH H, 1979, BEITR PLASMAPHYS, V19, P49
[7]  
DEUTSCH H, 1976, BEITR PLASMAPHYS, V16, P227
[8]  
EDELMANN C, 1985, WISSENSPEICHER VAKUU, P30
[9]  
Klagge S., 1975, BEITRA GE PLASMAPHYS, V15, P309, DOI [10.1002/ctpp.19750150605, DOI 10.1002/CTPP.19750150605]
[10]  
KUNZE D, 1967, Z ANGEW PHYSIK, V22, P69