2-DIMENSIONAL IMAGING OF CLEAVED SI P-N-JUNCTIONS WITH 30-NM RESOLUTION USING A UHV SCANNING TUNNELING MICROSCOPE

被引:10
作者
KORDIC, S
VANLOENEN, EJ
WALKER, AJ
机构
[1] Philips Research Laboratories
关键词
D O I
10.1109/55.119152
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
First two-dimensional scanning tunneling microscope (STM) measurements on cleaved shallow silicon p-n junctions are presented. The used current imaging technique provides contrast between p- and n-type regions on biased junctions. The two-dimensional part of the junction is imaged and localized to within 30 nm. Both the cleaving of the junction and the STM measurements are performed in ultrahigh vacuum (UHV).
引用
收藏
页码:422 / 424
页数:3
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