VLSI LIMITATIONS FROM DRAIN-INDUCED BARRIER LOWERING

被引:286
作者
TROUTMAN, RR
机构
[1] IBM General Technology Division, Essex Junction
关键词
D O I
10.1109/JSSC.1979.1051189
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Drain-induced barrier lowering (DIBL) determines the ultimate proximity of surface diffusions and qualifies as one of the fundamental electrical limitations for VLSI. The important design parameters relating to DIBL are Investigated using a numerical two-dimensional model, and a simple conceptual model is introduced as an aid for understanding the results. Under normal operating conditions of an IGFET, DIBL produces surface (rather than -bulk) injection at the source. Comparison of a base case with a scaled design reveals that simple linear scaling by itself is insufficient for holding DIBL to a tolerable amount. Copyright © 1979 by The Institute of Electrical and Electronics Engineers, Inc.
引用
收藏
页码:383 / 391
页数:9
相关论文
共 14 条