HILLOCK GROWTH IN THIN-FILMS

被引：185

作者：

CHAUDHAR.P ^{[1
]}

机构：

[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598

来源：

关键词：

D O I：

10.1063/1.1663054

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：4339 / 4346

页数：8

共 15 条

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[2] LOW-TEMPERATURE PROPERTIES OF EVAPORATED LEAD FILMS
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PRIEST, JR
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[3] GRAIN-GROWTH AND STRESS RELIEF IN THIN-FILMS
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[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (01): : 520 - &
[4] MECHANISMS OF STRESS RELIEF IN POLYCRYSTALLINE FILMS
CHAUDHARI, P
[J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1969, 13 (02) : 197 - +
[5] CHAUDHARI P, 1967, J VAC SCI TECHNOL, V6, P618
[6] Chirvinskii P. N., 1948, METEORITIKA, P75
[7] STRAIN-RELAXATION IN THIN-FILMS ON SUBSTRATES
GANGULEE, A
[J]. ACTA METALLURGICA, 1974, 22 (02): : 177 - 183
[8] GANGULEE A, PRIVATE COMMUNICATIO
[9] DIFFUSIONAL VISCOSITY OF A POLYCRYSTALLINE SOLID
HERRING, C
[J]. JOURNAL OF APPLIED PHYSICS, 1950, 21 (05) : 437 - 445
[10] HILDEBRAND FB, 1962, ADV CALCULUS APPLICA, P535