A NOVEL MULTICHIP MODULE ASSEMBLY APPROACH USING GOLD BALL FLIP-CHIP BONDING

Size is an important consideration for many electronic products, including portable communications equipment. This paper describes a multichip module (MCM) approach that dramatically reduces the circuit area of a portable communications transceiver. The MCM incorporated a 1-in square (2.54-cm square) silicon substrate fabricated with thin film resistors and a double metal linear process technology. The die bonding was performed with a flip-chip process that uses unmodified, off-the-shelf IC's. The process is performed using standard wirebonding equipment and a thermocompression flip-chip bond. The resulting MCM reduced the required circuit board area by 40%.