AL3TI FORMATION BY DIFFUSION OF ALUMINUM THROUGH TITANIUM

被引:30
作者
THUILLARD, M
TRAN, LT
NICOLET, MA
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D O I
10.1016/0040-6090(88)90362-8
中图分类号
T [工业技术];
学科分类号
08 ;
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页码:21 / 27
页数:7
相关论文
共 13 条
[1]  
BOWER RW, 1973, APPL PHYS LETT, V23, P99, DOI 10.1063/1.1654823
[2]   INFLUENCE OF CU AS AN IMPURITY IN AL/TI AND AL/W THIN-FILM REACTIONS [J].
KRAFCSIK, I ;
GYULAI, J ;
PALMSTROM, CJ ;
MAYER, JW .
APPLIED PHYSICS LETTERS, 1983, 43 (11) :1015-1017
[3]  
LEFAKIS H, 1986, MATER RES SOC S P, V54, P133
[4]   AUGER AND X-RAY PHOTOELECTRON SPECTROSCOPIC DEPTH PROFILING TECHNIQUES APPLIED TO ULTRATHIN TITANIUM FILMS [J].
LOFTON, CP ;
SWARTZ, WE .
THIN SOLID FILMS, 1978, 52 (02) :271-280
[5]  
Maissel L.L., 1970, HDB THIN FILM TECHNO, P5
[6]  
PROKOEV AV, 1976, SOV J NONFERROUS MET, V81
[7]   OXIDATION OF TITANIUM BETWEEN 25 DEGREES C AND 400 DEGREES C [J].
SMITH, T .
SURFACE SCIENCE, 1973, 38 (02) :292-312
[8]   SOLUTE EFFECT OF CU ON INTERDIFFUSION IN AL3TI COMPOUND FILMS [J].
TARDY, J ;
TU, KN .
PHYSICAL REVIEW B, 1985, 32 (04) :2070-2081
[9]   ELECTRICAL-PROPERTIES OF AL/TI CONTACT METALLURGY FOR VLSI APPLICATION [J].
TING, CY ;
CROWDER, BL .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1982, 129 (11) :2590-2594
[10]   EFFECT OF CU ON THE KINETICS AND MICROSTRUCTURE OF AL3TI FORMATION [J].
WITTMER, M ;
LEGOUES, F ;
HUANG, HCW .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (06) :1450-1455