RAPID THERMAL ANNEALING OF HOT IMPLANTS IN SILICON

被引:3
作者
COFFA, S
CALCAGNO, L
SPINELLA, C
CAMPISANO, SU
FOTI, G
RIMINI, E
机构
关键词
D O I
10.1016/0168-583X(89)90802-1
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
引用
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页码:357 / 361
页数:5
相关论文
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