THERMAL MONITORING OF MICROELECTRONIC STRUCTURES

被引：33

作者：

SZEKELY, V

机构：

[1] Technical University of Budapest, Department of Electron Devices

来源：

MICROELECTRONICS JOURNAL | 1994年 / 25卷 / 03期

基金：

匈牙利科学研究基金会;

关键词：

D O I：

10.1016/0026-2692(94)90008-6

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents possible solutions for the lifetime thermal monitoring of microelectronic structures. To capture the detailed thermal state of an encapsulated device, insertion of a number of temperature sensors is proposed. A new temperature sensor element is introduced: the thermal-feedback oscillator (TFO). This temperature sensor has a digital output signal, and is therefore suitable for integration with other built-in test circuits such as the boundary scan. The paper investigates the feasibility of the TFO temperature sensor. The last part of the paper deals with the heat-flow mapping of IC packages using a one-shot thermal transient registration method.

引用

页码：157 / 170

页数：14

共 12 条

[1] THERMAL OSCILLATOR USING THERMOELECTRIC (SEEBECK) EFFECT IN SILICON [J].