FABRICATION OF AU FINE PATTERNS BY AR SPUTTER ETCHING USING MOO3 MASK

A new fabrication technique of fine Au patterns using a bilevel MoO3 film is proposed. In this process, the MoO3 film is used as an electron resist for patterning, followed by Au layer etching with Ar-ion sputtering, using the bilevel MoO3 layer as a mask. The upper layer of the bilevel MoO3 resist is suitable for use as a mask layer. The lower layer, which is sputter-deposited with lower rf power, is useful for easy removal of the MoO3 mask after sputter etching of the Au layer.