VERSATILE TA2N-W-AU-SIO2-AL-SIO2 THIN-FILM HYBRID MICROCIRCUIT METALLIZATION SYSTEM

被引：5

作者：

HAMPY, RE ^{[1
]}

机构：

[1] SANDIA LABS,HYBRID MICROCIRCUIT TECHNOL DIV,ALBUQUERQUE,NM 87115

来源：

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1975年 / 11卷 / 04期

关键词：

D O I：

10.1109/TPHP.1975.1135075

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：263 / 272

页数：10

共 25 条

[1]

BERRY RW, 1968, THIN FILM TECHNOLOGY, P341

[2]

BLECH I, 1970, HDB THIN FILM TECHNO, pCH23

[3]

BRADY TE, 1973, IEEE T PHP, V4, P181

[4] METAL-CERAMIC CONSTRAINTS FOR MULTILARYER ELECTRONIC PACKAGES [J].

CHANCE, DA ;

WILCOX, DL .

PROCEEDINGS OF THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, 1971, 59 (10) :1455-&

CHRISTOU, A ;

DAY, HM .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1973, PHP9 (04) :224-229

[6]

CLARK RJ, 1974, P ISHM S, P131

[7] CHARACTERIZATION OF MULTILEVEL INTERCONNECTION DEFECTS [J].

COX, RH ;

HENTZSCHEL, H .

[8]

CUNNINGHAM JA, 1968, OHMIC CONTACTS SEMIC, P300

[9]

ELLIOT RP, 1965, CONSTITUTION BINARY, P107

[10]

GARGIONE F, 1972, P ELEC COMP C, P181