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RESIDUAL STRAINS OF PB THIN-FILMS DEPOSITED ONTO SI SUBSTRATES
被引:71
作者
:
MURAKAMI, M
论文数:
0
引用数:
0
h-index:
0
MURAKAMI, M
机构
:
来源
:
ACTA METALLURGICA
|
1978年
/ 26卷
/ 01期
关键词
:
D O I
:
10.1016/0001-6160(78)90214-6
中图分类号
:
TF [冶金工业];
学科分类号
:
0806 ;
摘要
:
引用
收藏
页码:175 / 183
页数:9
相关论文
共 28 条
[1]
FIRST REPORT ON DEFORMATION-MECHANISM MAPS
ASHBY, MF
论文数:
0
引用数:
0
h-index:
0
ASHBY, MF
[J].
ACTA METALLURGICA,
1972,
20
(07):
: 887
-
+
[2]
LOW-TEMPERATURE PROPERTIES OF EVAPORATED LEAD FILMS
CASWELL, HL
论文数:
0
引用数:
0
h-index:
0
CASWELL, HL
PRIEST, JR
论文数:
0
引用数:
0
h-index:
0
PRIEST, JR
BUDO, Y
论文数:
0
引用数:
0
h-index:
0
BUDO, Y
[J].
JOURNAL OF APPLIED PHYSICS,
1963,
34
(11)
: 3261
-
&
[3]
HILLOCK GROWTH IN THIN-FILMS
CHAUDHAR.P
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
CHAUDHAR.P
[J].
JOURNAL OF APPLIED PHYSICS,
1974,
45
(10)
: 4339
-
4346
[4]
MECHANISMS OF STRESS RELIEF IN POLYCRYSTALLINE FILMS
CHAUDHARI, P
论文数:
0
引用数:
0
h-index:
0
CHAUDHARI, P
[J].
IBM JOURNAL OF RESEARCH AND DEVELOPMENT,
1969,
13
(02)
: 197
-
+
[5]
Chirvinskii P. N., 1948, METEORITIKA, P75
[6]
A MODEL FOR BOUNDARY DIFFUSION CONTROLLED CREEP IN POLYCRYSTALLINE MATERIALS
COBLE, RL
论文数:
0
引用数:
0
h-index:
0
COBLE, RL
[J].
JOURNAL OF APPLIED PHYSICS,
1963,
34
(06)
: 1679
-
&
[7]
STRUCTURE OF ELECTROPLATED AND VAPOR-DEPOSITED COPPER FILMS
GANGULEE, A
论文数:
0
引用数:
0
h-index:
0
GANGULEE, A
[J].
JOURNAL OF APPLIED PHYSICS,
1972,
43
(03)
: 867
-
+
[8]
STRAIN-RELAXATION IN THIN-FILMS ON SUBSTRATES
GANGULEE, A
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP, THOMAS J WATSON RES CTR, YORKTOWN HTS, NY 10598 USA
IBM CORP, THOMAS J WATSON RES CTR, YORKTOWN HTS, NY 10598 USA
GANGULEE, A
[J].
ACTA METALLURGICA,
1974,
22
(02):
: 177
-
183
[9]
DIFFUSION CREEP OF A THIN FOIL
GIBBS, GB
论文数:
0
引用数:
0
h-index:
0
GIBBS, GB
[J].
PHILOSOPHICAL MAGAZINE,
1966,
13
(123):
: 589
-
&
[10]
GRAY DE, 1972, AM I PHYSICS HDB
←
1
2
3
→
共 28 条
[1]
FIRST REPORT ON DEFORMATION-MECHANISM MAPS
ASHBY, MF
论文数:
0
引用数:
0
h-index:
0
ASHBY, MF
[J].
ACTA METALLURGICA,
1972,
20
(07):
: 887
-
+
[2]
LOW-TEMPERATURE PROPERTIES OF EVAPORATED LEAD FILMS
CASWELL, HL
论文数:
0
引用数:
0
h-index:
0
CASWELL, HL
PRIEST, JR
论文数:
0
引用数:
0
h-index:
0
PRIEST, JR
BUDO, Y
论文数:
0
引用数:
0
h-index:
0
BUDO, Y
[J].
JOURNAL OF APPLIED PHYSICS,
1963,
34
(11)
: 3261
-
&
[3]
HILLOCK GROWTH IN THIN-FILMS
CHAUDHAR.P
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
CHAUDHAR.P
[J].
JOURNAL OF APPLIED PHYSICS,
1974,
45
(10)
: 4339
-
4346
[4]
MECHANISMS OF STRESS RELIEF IN POLYCRYSTALLINE FILMS
CHAUDHARI, P
论文数:
0
引用数:
0
h-index:
0
CHAUDHARI, P
[J].
IBM JOURNAL OF RESEARCH AND DEVELOPMENT,
1969,
13
(02)
: 197
-
+
[5]
Chirvinskii P. N., 1948, METEORITIKA, P75
[6]
A MODEL FOR BOUNDARY DIFFUSION CONTROLLED CREEP IN POLYCRYSTALLINE MATERIALS
COBLE, RL
论文数:
0
引用数:
0
h-index:
0
COBLE, RL
[J].
JOURNAL OF APPLIED PHYSICS,
1963,
34
(06)
: 1679
-
&
[7]
STRUCTURE OF ELECTROPLATED AND VAPOR-DEPOSITED COPPER FILMS
GANGULEE, A
论文数:
0
引用数:
0
h-index:
0
GANGULEE, A
[J].
JOURNAL OF APPLIED PHYSICS,
1972,
43
(03)
: 867
-
+
[8]
STRAIN-RELAXATION IN THIN-FILMS ON SUBSTRATES
GANGULEE, A
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP, THOMAS J WATSON RES CTR, YORKTOWN HTS, NY 10598 USA
IBM CORP, THOMAS J WATSON RES CTR, YORKTOWN HTS, NY 10598 USA
GANGULEE, A
[J].
ACTA METALLURGICA,
1974,
22
(02):
: 177
-
183
[9]
DIFFUSION CREEP OF A THIN FOIL
GIBBS, GB
论文数:
0
引用数:
0
h-index:
0
GIBBS, GB
[J].
PHILOSOPHICAL MAGAZINE,
1966,
13
(123):
: 589
-
&
[10]
GRAY DE, 1972, AM I PHYSICS HDB
←
1
2
3
→