AN XPS STUDY OF THE AR+-INDUCED REDUCTION OF NI2+ IN NIO AND NI-SI OXIDE SYSTEMS

被引:54
作者
GONZALEZELIPE, AR [1 ]
ALVAREZ, R [1 ]
HOLGADO, JP [1 ]
ESPINOS, JP [1 ]
MUNUERA, G [1 ]
机构
[1] UNIV AUTONOMA MADRID,DEPT FIS APLICADA C-XII,E-28049 MADRID,SPAIN
关键词
D O I
10.1016/0169-4332(91)90058-R
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The reduction effect on the Ni2+ species induced by 3.5 keV Ar+ bombardment of NiO particles dispersed on SiO2 and on NiSiO3 as well as on two NiO powder samples with different grain sizes has been quantitatively studied by XPS. In all the cases reduction of the Ni2+ species to metallic Ni-degrees has been observed. However, it is also shown that Ar+-bombardment-induced reduction of Ni2+ is strongly enhanced by the presence of Si4+ cations, which on the other hand remain stable.
引用
收藏
页码:19 / 26
页数:8
相关论文
共 27 条
[1]  
BETZ G, 1984, SPUTTERING PARTICLE, V2, pCH2
[2]  
COENEN JWE, 1981, REPORT RES GROUP CAT
[3]   COMPOSITIONAL CHANGES INDUCED BY 3.5 KEV AR+ION BOMBARDMENT IN NI-TI OXIDE SYSTEMS - A COMPARATIVE-STUDY [J].
GONZALEZELIPE, AR ;
MUNUERA, G ;
ESPINOS, JP ;
SANZ, JM .
SURFACE SCIENCE, 1989, 220 (2-3) :368-380
[4]  
Gravelle P.C., 1969, ADV CATAL, V20, P167
[5]   DIFFERENTIAL SPUTTERING OF MGO/AU CERMET FILMS AND ITS APPLICATION TO HIGH-YIELD SECONDARY-ELECTRON EMITTERS [J].
HENRICH, VE ;
FAN, JCC .
SURFACE SCIENCE, 1974, 42 (01) :139-156
[6]   ION-BEAM-INDUCED CHEMICAL-CHANGES IN THE OXYANIONS (CROYN-, MOOYN-, WOYN-, VOYN-, NBOYN-, AND TAOYN-) AND OXIDES (CROX, MOOX, WOX, VOX, NBOX, AND TAOX) [J].
HO, SF ;
CONTARINI, S ;
RABALAIS, JW .
JOURNAL OF PHYSICAL CHEMISTRY, 1987, 91 (18) :4779-4788
[7]  
HOFMANN S, 1983, J VAC SCI TECHNOL B, V1, P135
[8]  
Hofmann S., 1982, J TRACE MICROPROBE T, V1, P213
[9]  
HULLOA M, 1981, J PHYS CHEM-US, V85, P1704
[10]   BOMBARDMENT-INDUCED COMPOSITIONAL CHANGE WITH ALLOYS, OXIDES, OXYSALTS AND HALIDES .3. THE ROLE OF CHEMICAL DRIVING FORCES [J].
KELLY, R .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1989, 115 :11-24