MODELING AND ANALYSIS OF MULTICHIP-MODULE POWER-SUPPLY PLANES

被引：137

作者：

LEE, K

BARBER, A

机构：

[1] Hewlett-Packard Laboratories, Palo Alto

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1995年 / 18卷 / 04期

关键词：

D O I：

10.1109/96.475268

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A method that would allow accurate modeling of arbitrarily shaped planes with bypass capacitors has been developed, It is compatible with a SPICE-based modeling method for the rest of the power supply hierarchy and the devices. A modified SPICE is used to accommodate distributed circuits. The distributed circuits are built with microwave analysis software and connected to SPICE by s-parameter files. The modeling process is described and examples of thick and thin-film power supply planes are presented with comparison to measured results. The method is used to explore potential design choices for a large MCM with many simultaneously switching drivers.

引用

页码：628 / 639

页数：12

共 12 条

[1] A BARE-CHIP PROBE FOR HIGH I/O, HIGH-SPEED TESTING [J].