INTERFACIAL FREE-ENERGIES FROM SUBSTRATE CURVATURE MEASUREMENTS OF THE CREEP OF MULTILAYER THIN-FILMS

被引：12

作者：

JOSELL, D

机构：

[1] National Institute of Standards and Technology, Gaithersburg

来源：

ACTA METALLURGICA ET MATERIALIA | 1994年 / 42卷 / 03期

关键词：

D O I：

10.1016/0956-7151(94)90297-6

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The equilibrium biaxial curvature of a multilayer thin film adhering to a free standing substrate is determined when plastic flow is possible in the multilayer. The relationship found between the equilibrium biaxial curvature and the interfaces in the multilayer is modified to account for grain boundaries in the layers. Two possible experiments that utilize the resulting relationship to determine interfacial free energies are described.

引用

页码：1031 / 1038

页数：8

共 40 条

[1] INTERFACE CONTROLLED DIFFUSIONAL CREEP [J].

ARZT, E ;

ASHBY, MF ;

VERRALL, RA .

ACTA METALLURGICA, 1983, 31 (12) :1977-1989

[2]

Brooks H., 1952, MET INTERFACES AM SO, P20

[3]

Cahn J. W., 1978, THERMODYNAMICS SOLID, P3

[4] SURFACE STRESS AND THE CHEMICAL-EQUILIBRIUM OF SMALL CRYSTALS .2. SOLID PARTICLES EMBEDDED IN A SOLID MATRIX [J].

CAHN, JW ;

LARCHE, F .

ACTA METALLURGICA, 1982, 30 (01) :51-56

[5] EFFECTS OF SURFACE STRESS ON THE ELASTIC-MODULI OF THIN-FILMS AND SUPERLATTICES [J].

CAMMARATA, RC ;

SIERADZKI, K .

PHYSICAL REVIEW LETTERS, 1989, 62 (17) :2005-2008

[6] STRESSES AND DEFORMATION PROCESSES IN THIN-FILMS ON SUBSTRATES [J].

DOERNER, MF ;

NIX, WD .

CRC CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES, 1988, 14 (03) :225-268

[7] SIMULATION OF THIN-FILM GRAIN STRUCTURES .1. GRAIN-GROWTH STAGNATION [J].

FROST, HJ ;

THOMPSON, CV ;

WALTON, DT .

ACTA METALLURGICA ET MATERIALIA, 1990, 38 (08) :1455-1462

[8]

FROST HJ, 1982, DEFORMATION MECHANIS

[9]

FULLER ER, 1991, TOUGHENING MECHANISM

[10] SURFACE TENSION OF SOLID SILVER [J].

FUNK, ER ;

UDIN, H ;

WULFF, J .

JOURNAL OF METALS, 1951, 3 (12) :1206-1208

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