HIGH-TEMPERATURE CHARGE LOSS MECHANISM IN A FLOATING-GATE EPROM WITH AN OXIDE-NITRIDE-OXIDE (ONO) INTERPOLY STACKED DIELECTRIC

被引:12
作者
PAN, CS
WU, K
CHIN, D
SERY, G
KIELY, J
机构
[1] Intel Corporation, Santa Clara
关键词
D O I
10.1109/55.116933
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The intrinsic charge loss rate of a floating-gate EPROM cell at temperatures above 300-degrees-C appears to be much higher than the prediction from our previous model developed at lower temperatures. A detailed study of intrinsic charge loss rate at temperatures ranging from 340 to 430-degrees-C reveals that it follows a Frenkel-Poole model with a barrier height of 1.9 eV. The physical origin of this high-temperature charge loss is proposed. The model suggests that electrons leak through the thin bottom poly oxide and nitride, and then thermally surmount the barrier at the nitride/top-oxide interface.
引用
收藏
页码:506 / 509
页数:4
相关论文
共 6 条
[1]  
Mielke N. R., 1983, 21st Annual Proceedings on Reliability Physics 1983, P106, DOI 10.1109/IRPS.1983.361969
[2]   A THERMIONIC ELECTRON-EMISSION MODEL FOR CHARGE RETENTION IN SAMOS STRUCTURES [J].
NOZAWA, H ;
KOHYAMA, S .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1982, 21 (02) :L111-L112
[3]   PHYSICAL ORIGIN OF LONG-TERM CHARGE LOSS IN FLOATING-GATE EPROM WITH AN INTERPOLY OXIDE NITRIDE OXIDE STACKED DIELECTRIC [J].
PAN, CS ;
WU, K ;
SERY, G .
IEEE ELECTRON DEVICE LETTERS, 1991, 12 (02) :51-53
[4]   A SCALING METHODOLOGY FOR OXIDE NITRIDE OXIDE INTERPOLY DIELECTRIC FOR EPROM APPLICATIONS [J].
PAN, CS ;
WU, KJ ;
FREIBERGER, PP ;
CHATTERJEE, A ;
SERY, G .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1990, 37 (06) :1439-1443
[5]  
SZE SM, 1981, PHYSICS SEMICONDUCTO
[6]  
Wu K., 1990, 28th Annual Proceedings. Reliability Physics 1990 (Cat. No.90CH2787-0), P145, DOI 10.1109/RELPHY.1990.66077