TUNGSTEN SILICIDE BARRIER LAYERS IN ALUMINUM OHMIC CONTACT SYSTEMS

被引：6

作者：

HARA, T

HAYASHIDA, H

TAKAHASHI, S

YAMANOUE, A

机构：

来源：

THIN SOLID FILMS | 1989年 / 177卷

关键词：

D O I：

10.1016/0040-6090(89)90552-X

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：9 / 16

页数：8

共 12 条

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