APPLICATION OF TI-W BARRIER METALLIZATION FOR INTEGRATED-CIRCUITS

被引：100

作者：

GHATE, PB

BLAIR, JC

FULLER, CR

MCGUIRE, GE

机构：

来源：

THIN SOLID FILMS | 1978年 / 53卷 / 02期

关键词：

D O I：

10.1016/0040-6090(78)90024-X

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：117 / 128

页数：12

共 24 条

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