CRITICAL THICKNESS OF GAAS/INGAAS AND ALGAAS/GAASP STRAINED QUANTUM-WELLS GROWN BY ORGANOMETALLIC CHEMICAL VAPOR-DEPOSITION

被引:11
作者
BERTOLET, DC
HSU, JK
AGAHI, F
LAU, KM
机构
[1] Compound Semiconductor Laboratory, Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, 01003, MA
关键词
critical thickness; GaAs/InGaAs; strained quantum wells;
D O I
10.1007/BF02652923
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper we describe a study of strained quantum wells (QWs) as a means to experimentally observe the critical thickness (h c) for the formation of interfacial misfit dislocations. Two material systems were investigated: GaAs/In0.11Ga0.89As, in which the QW layers are under biaxial compression, and Al0.35Ga0.65As/GaAs0.82P0.18, in which the QW layers are under biaxial tension. Samples were grown by atmospheric pressure organometallic chemical vapor deposition, and characterized by low-temperature photoluminescence (PL), x-ray diffraction, optical microscopy, and Hall measurements. For both material systems, the observed onset of dislocation formation agrees well with the force-balance model assuming a double-kink mechanism. However, overall results indicate that the relaxation is inhomogeneous. Annealing at 800-850° C had no significant effect on the PL spectra, signifying that even layers that have exceeded h c and have undergone partial relaxation are thermodynamically stable against further dislocation propagation. © 1990 AIME.
引用
收藏
页码:967 / 974
页数:8
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