REACTIVE SPUTTER ETCHING OF MAGNETIC-MATERIALS IN AN HCL PLASMA

被引:15
作者
HEIJMAN, MGJ
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D O I
10.1007/BF01016056
中图分类号
TQ [化学工业];
学科分类号
0817 ;
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页码:383 / 397
页数:15
相关论文
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