VOLTAGE CONTRAST ELECTRON-BEAM TESTING EXPERIMENTS ON VERY LARGE-SCALE INTEGRATED CHIP PACKAGING SUBSTRATES

被引：7

作者：

WOODARD, OC

HARTNETT, F

MYERS, T

ROSS, A

THOMPSON, R

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1988年 / 6卷 / 06期

关键词：

D O I：

10.1116/1.584146

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：1966 / 1970

页数：5

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[2]

DAVIS DE, 1977, IBM J RES DEV, V221, P498

[3]

FROEBERG CE, 1965, INTRO NUMERICAL ANAL, P156

[4] BACKGROUND AND APPLICATIONS OF ELECTRON BEAM TEST TECHNIQUES. [J].

Hohn, Fritz J. .

[5]

OATLEY CW, 1972, SCANNING ELECTRON MI, P156

PFEIFFER, HC ;

LANGNER, GO ;

STICKEL, W ;

SIMPSON, RA .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1981, 19 (04) :1014-1018

[7] SECONDARY-ELECTRON EMISSION IN THE SCANNING ELECTRON-MICROSCOPE [J].

SEILER, H .

[8]

Seiler H, 1984, SCANNING ELECTRON MI, V3, P1081