MATHEMATICAL-MODELING OF ELECTROPLATING IN HIGH ASPECT RATIO THROUGH-HOLES OF MULTILAYER PRINTED-CIRCUIT BOARDS

被引:2
作者
HAZLEBECK, DA [1 ]
机构
[1] UNIV CALIF SAN DIEGO,LA JOLLA,CA 92093
关键词
Copper Plating - Electroplating--Mathematical Models;
D O I
10.1149/1.2096871
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Many previous models have examined electroplating of through-holes under various limiting conditions but have not included the effects of plating additives or the coupling of potential and concentration gradients. Our previous model of through-hole plating included the effects of additives and the coupling of potential and concentration gradients considering stagnant fluid in the through-hole. In this paper, a model is developed which includes the effects of convective, diffusive, and ohmic transport in electroplating of through-holes with additives to the plating bath. The solution of the model is used to examine the effects of additives and other process variables on uniformity of deposition.
引用
收藏
页码:C215 / C218
页数:4
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