INSITU FORMATION OF DIFFUSION BARRIERS IN THIN-FILM METALLIZATION SYSTEMS

被引：28

作者：

HOLLOWAY, PH ^{[1
]}

NELSON, CC ^{[1
]}

机构：

[1] SANDIA LABS,ALBUQUERQUE,NM 87115

来源：

关键词：

D O I：

10.1016/0040-6090(76)90233-9

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：L13 / L16

页数：4

共 7 条

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[2] CHEMICAL CLEANING FOR THERMOCOMPRESSION BONDING
HOLLOWAY, PH
LONG, RL
[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1975, PH11 (02): : 83 - 88
[3] HOLLOWAY PH, 1975, SAND750216 SAND LAB
[4] THIN-FILM METALLIZATION OF OXIDES IN MICROELECTRONICS
MATTOX, DM
[J]. THIN SOLID FILMS, 1973, 18 (02) : 173 - 186
[5] NELSON GC, STP596 ASTM
[6] ANALYSIS OF SURFACE COMPOSITION WITH LOW-ENERGY BACKSCATTERED IONS
SMITH, DP
[J]. SURFACE SCIENCE, 1971, 25 (01) : 171 - &
[7] TYLECOTE FF, 1968, SOLID PHASE WELDING