NEW PROFILE OF ULTRA LOW STRESS RESIN ENCAPSULANTS FOR LARGE CHIP SEMICONDUCTOR-DEVICES

被引：4

作者：

NAKAMURA, Y ^{[1
]}

UENISHI, S ^{[1
]}

KUNISHI, T ^{[1
]}

MIKI, K ^{[1
]}

TABATA, H ^{[1
]}

KUWADA, K ^{[1
]}

SUZUKI, H ^{[1
]}

MATSUMOTO, T ^{[1
]}

机构：

[1] KOBE UNIV,FAC ENGN,NADA KU,KOBE 657,JAPAN

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1987年 / 10卷 / 04期

关键词：

D O I：

10.1109/TCHMT.1987.1134798

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：502 / 506

页数：5

共 6 条

[1] LOW-STRESS RESIN ENCAPSULANTS FOR SEMICONDUCTOR-DEVICES [J].

KUWATA, K ;

IKO, K ;

TABATA, H .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1985, 8 (04) :486-489

[2] INTERNAL-STRESS OF EPOXY-RESIN MODIFIED WITH ACRYLIC CORE-SHELL PARTICLES CONTAINING FUNCTIONAL-GROUPS PREPARED BY SEEDED EMULSION POLYMERIZATION [J].

NAKAMURA, Y ;

TABATA, H ;

SUZUKI, H ;

IKO, K ;

OKUBO, M ;

MATSUMOTO, T .

JOURNAL OF APPLIED POLYMER SCIENCE, 1987, 33 (03) :885-897

[3] INTERNAL-STRESS OF EPOXY-RESIN MODIFIED WITH ACRYLIC CORE-SHELL PARTICLES PREPARED BY SEEDED EMULSION POLYMERIZATION [J].

NAKAMURA, Y ;

TABATA, H ;

SUZUKI, H ;

IKO, K ;

OKUBO, M ;

MATSUMOTO, T .

JOURNAL OF APPLIED POLYMER SCIENCE, 1986, 32 (05) :4865-4871

[4]

OIZUMI S, 1987, ACS SYM SER, V346, P537

[5]

Sperling L. H, 1985, MULTICOMPONENT POLYM, V211

[6] STRESS-INDUCED DEFORMATION OF ALUMINUM METALLIZATION IN PLASTIC MOLDED SEMICONDUCTOR-DEVICES [J].

THOMAS, RE .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1985, 8 (04) :427-434

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