DEPOSITION OF NOBLE METAL CONTACTS ON YBA(2)CU(3)O(7-X) THIN FILMS

被引:6
作者
Hahn, R. [1 ]
Schaeffter, T. [1 ]
Klockau, J. [1 ]
Fotheringham, G. [1 ]
机构
[1] Tech Univ Berlin, Gustav Meyer Allee 25,TIB 4-2-1, D-1000 Berlin 65, Germany
关键词
6;
D O I
10.1109/77.234029
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Ohmic contacts with low specific contact resistivities between YBa2Cu3O7-X thin films and noble metals have been fabricated using ion beam sputter etching and RF-Plasma contact preparation. The influence of deposition parameters has been investigated. Specific contact resistivities in the 10(-8) Omega cm(2) range at 77 K have been achieved and were evaluated using Cross Bridge Kelvin test structures with varying sizes between 5 and 50 mu m. The failure rate of wires bonded onto HTSC-Au/Ag pads was unacceptable in most cases. Substantial improvements have been achieved with Cr/Ti adhesion sublayers. Deposition parameters for optimum pull test results on MgO and LaAlO3 substrates are presented.
引用
收藏
页码:2979 / 2982
页数:4
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