INTERACTION OF EVAPORATED COPPER WITH VAPOR-DEPOSITED THIN POLYIMIDE FILMS

被引:23
作者
STRUNSKUS, T [1 ]
HAHN, C [1 ]
FRANKEL, D [1 ]
GRUNZE, M [1 ]
机构
[1] UNIV HEIDELBERG, INST ANGEW PHYS CHEM, W-6900 HEIDELBERG, GERMANY
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A | 1991年 / 9卷 / 03期
关键词
D O I
10.1116/1.577611
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The interaction of evaporated copper deposits with vapor-deposited, vacuum-cured thin films of pyromellitic dianhydride-oxydianiline (PMDA-ODA) polyimide was studied using x-ray photoelectron spectroscopy (XPS) and Fourier transform infrared reflection absorption spectroscopy (FTIRAS). XPS and FTIRAS measurements indicate a preferential interaction of the copper with the imide part of the molecule, some interaction with the ODA ether oxygen and only a weak interaction with the phenyl rings. The spectral changes observed show a dependence on the rate of the copper deposition.
引用
收藏
页码:1272 / 1277
页数:6
相关论文
共 19 条
[1]  
CHOU NJ, 1984, J VAC SCI TECHNOL A, V2, P751, DOI 10.1116/1.572564
[3]  
DOMINGUE A, 1990, ACS SYM SER, V440, P272
[4]   INFRARED SPECTROSCOPIC STUDY OF CR AND CU METALLIZATION OF POLYIMIDE [J].
DUNN, DS ;
GRANT, JL .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1989, 7 (02) :253-255
[5]  
GRUNZE M, 1990, IN PRESS 2ND P S MET
[6]  
HAHN PO, 1985, MATER RES SOC S P, V40, P252
[7]   COMPLEX-FORMATION AND GROWTH AT THE CR-POLYIMIDE AND CU-POLYIMIDE INTERFACE [J].
HAIGHT, R ;
WHITE, RC ;
SILVERMAN, BD ;
HO, PS .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1988, 6 (04) :2188-2199
[8]   CHEMICAL BONDING AND REACTION AT METAL POLYMER INTERFACES [J].
HO, PS ;
HAHN, PO ;
BARTHA, JW ;
RUBLOFF, GW ;
LEGOUES, FK ;
SILVERMAN, BD .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (03) :739-745
[9]  
IIJIMA M, 1985, J VAC SOC JPN, V28, P437
[10]   THE MICROSTRUCTURE OF METAL POLYIMIDE INTERFACES [J].
LEGOUES, FK ;
SILVERMAN, BD ;
HO, PS .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1988, 6 (04) :2200-2204