IMPROVEMENT OF CMOS LATCH-UP IMMUNITY USING A HIGH-ENERGY IMPLANTED BURIED LAYER

被引:21
作者
LIN, HY
TING, CH
机构
关键词
D O I
10.1016/0168-583X(89)90334-0
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
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页码:960 / 964
页数:5
相关论文
共 9 条
[1]  
Combs S. R., 1981, International Electron Devices Meeting, P346
[2]  
Estreich D. B., 1978, IEDM, P230, DOI [10.1109/IEDM.1978.189394, DOI 10.1109/IEDM.1978.189394]
[3]   A HIGHLY LATCHUP-IMMUNE L-MU-M CMOS TECHNOLOGY FABRICATED WITH L-MEV ION-IMPLANTATION AND SELF-ALIGNED TISI2 [J].
LAI, FSJ ;
WANG, LK ;
TAUR, Y ;
SUN, JYC ;
PETRILLO, KE ;
CHICOTKA, SK ;
PETRILLO, EJ ;
POLCARI, MR ;
BUCELOT, TJ ;
ZICHERMAN, DS .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1986, 33 (09) :1308-1320
[4]  
LIN HY, 1987, INT WORKSHOP HIGH EN
[5]  
PRAMANIK D, 1984, SOLID STATE TECHNOL, V27, P211
[6]  
Rung R. D., 1982, International Electron Devices Meeting. Technical Digest, P237
[7]  
TAMURA M, 1986, C SOLID STATE DEVICE, P537
[8]  
Terrill K. W., 1984, International Electron Devices Meeting. Technical Digest (Cat. No. 84CH2099-0), P406
[9]   DEVICE CHARACTERISTICS OF MOSFETS IN MEV IMPLANTED SUBSTRATES [J].
ZAPPE, HP ;
HU, CM .
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 1987, 21 (2-4) :163-167