LOW-TEMPERATURE PROCESS TO INCREASE THE GRAIN-SIZE IN POLYSILICON FILMS

被引:37
作者
REIF, R
KNOTT, JE
机构
关键词
D O I
10.1049/el:19810413
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:586 / 588
页数:3
相关论文
共 6 条
[1]  
Blum N. A., 1972, Journal of Non-Crystalline Solids, V11, P242, DOI 10.1016/0022-3093(72)90006-3
[2]   CRITICAL CHANNELING ANGLES OF LOW-ENERGY IONS IN SILICON [J].
GRAHMANN, H ;
FEUERSTEIN, A ;
KALBITZER, S .
RADIATION EFFECTS AND DEFECTS IN SOLIDS, 1976, 29 (02) :117-119
[3]   STRUCTURE AND STABILITY OF LOW-PRESSURE CHEMICALLY VAPOR-DEPOSITED SILICON FILMS [J].
KAMINS, TI ;
MANDURAH, MM ;
SARASWAT, KC .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1978, 125 (06) :927-932
[4]   REGROWTH OF AMORPHOUS FILMS [J].
LAU, SS .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (05) :1656-1661
[5]  
MAYER JW, 1970, ION IMPLANTATION SEM, P45
[6]   SUBSTRATE TEMPERATURE-MEASUREMENT DURING ION-IMPLANTATION [J].
WADA, Y ;
USUI, H ;
ASHIKAWA, M .
JAPANESE JOURNAL OF APPLIED PHYSICS, 1975, 14 (09) :1351-1356