A STUDY ON STRESS-INDUCED MIGRATION IN ALUMINUM METALLIZATION BASED ON DIRECT STRESS MEASUREMENTS

被引:29
作者
HINODE, K
ASANO, I
ISHIBA, T
HOMMA, Y
机构
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1990年 / 8卷 / 03期
关键词
D O I
10.1116/1.585050
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:495 / 498
页数:4
相关论文
共 18 条
[1]  
Burton B., 1977, DIFFUSIONAL CREEP PO
[2]  
Cullity B. D., 1956, ELEMENTS XRAY DIFFRA
[3]  
Curry J., 1984, 22nd Annual Proceedings on Reliability Physics 1984 (Catalog No. 84CH1990-1), P6, DOI 10.1109/IRPS.1984.362013
[4]  
Groothuis S. K., 1987, 25th Annual Proceedings: Reliability Physics 1987 (Cat. No.87CH2388-7), P1, DOI 10.1109/IRPS.1987.362147
[5]   VOID FORMATION MECHANISM IN VLSI ALUMINUM METALLIZATION [J].
HINODE, K ;
ASANO, I ;
HOMMA, Y .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1989, 36 (06) :1050-1055
[6]   STRESS-INDUCED GRAIN-BOUNDARY FRACTURES IN AL-SI INTERCONNECTS [J].
HINODE, K ;
OWADA, N ;
NISHIDA, T ;
MUKAI, K .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1987, 5 (02) :518-522
[7]  
HINODE K, 1988, 5TH P VLSI MULT INT, P429
[8]  
Jones R. E. Jr., 1987, 25th Annual Proceedings: Reliability Physics 1987 (Cat. No.87CH2388-7), P9, DOI 10.1109/IRPS.1987.362148
[9]  
Koyama H., 1986, 24th Annual Proceedings Reliability Physics 1986 (Cat. No.86CH2256-6), P24, DOI 10.1109/IRPS.1986.362107
[10]  
LEMAY I, 1981, PRINCIPLE MECHANICAL, P347