ELECTROMIGRATION IN THIN GOLD FILMS

被引：39

作者：

KLEIN, BJ ^{[1
]}

机构：

[1] CNRS,LAB PHYS MAT,BELLEVUE 92,FRANCE

来源：

JOURNAL OF PHYSICS F-METAL PHYSICS | 1973年 / 3卷 / 04期

关键词：

D O I：

10.1088/0305-4608/3/4/010

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

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页码：691 / &

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[5] CARSLAW HS, 1959, CONDUCTION HEAT SOLI
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[8] CURRENT-INDUCED MARKER MOTION IN GOLD WIRES
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[9] INFLUENCE OF OXYGEN ON ADHERENCE OF GOLD FILMS TO OXIDE SUBSTRATES
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[10] RESISTANCE MONITORING AND EFFECTS OF NONADHESION DURING ELECTROMIGRATION IN ALUMINUM FILMS
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