IMPLANTED CARBON - AN EFFECTIVE ETCH-STOP IN SILICON

被引:12
作者
LEHMANN, V [1 ]
MITANI, K [1 ]
FEIJOO, D [1 ]
GOSELE, U [1 ]
机构
[1] DUKE UNIV,SCH ENGN,DURHAM,NC 27706
关键词
D O I
10.1149/1.2085826
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Etch-rate measurements in KOH and ethylene diamine pyrocatechol (EDP) solutions have been made with carbon implanted silicon samples. It is shown that an implanted carbon layer is an effective etch-stop in silicon and allows the production of silicon-on-insulator (SOI) layers thinner than 0.1-mu-m with a single etch-stop layer.
引用
收藏
页码:L3 / L4
页数:2
相关论文
共 10 条
[1]  
BOGH A, 1971, J ELECTROCHEM SOC, V118, P401
[2]  
CHEVACHAROENKUL S, IN PRESS APPL PHYS L
[3]  
FEIJOO D, UNPUB
[4]   SEMICONDUCTOR WAFER BONDING [J].
LEHMANN, V ;
ONG, IWK ;
GOSELE, U ;
STENGL, R ;
MITANI, K .
ADVANCED MATERIALS, 1990, 2 (08) :372-374
[5]   BONDING OF SILICON-WAFERS FOR SILICON-ON-INSULATOR [J].
MASZARA, WP ;
GOETZ, G ;
CAVIGLIA, A ;
MCKITTERICK, JB .
JOURNAL OF APPLIED PHYSICS, 1988, 64 (10) :4943-4950
[6]   SILICON-ON-INSULATOR BY WAFER BONDING - A REVIEW [J].
MASZARA, WP .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1991, 138 (01) :341-347
[7]  
Price J. B., 1973, SEMICONDUCTOR SILICO, P339
[8]  
SODERBARG A, 1989, IEEE SOS SOI TECHNOL, P64
[9]   BUBBLE-FREE SILICON-WAFER BONDING IN A NON-CLEANROOM ENVIRONMENT [J].
STENGL, R ;
AHN, KY ;
GOSELE, U .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 1988, 27 (12) :L2364-L2366
[10]   CROSS-SECTION TRANSMISSION ELECTRON-MICROSCOPY STUDY OF CARBON-IMPLANTED LAYERS IN SILICON [J].
WONG, H ;
LOU, J ;
CHEUNG, NW ;
KVAM, EP ;
YU, KM ;
OLSON, DA ;
WASHBURN, J .
APPLIED PHYSICS LETTERS, 1990, 57 (08) :798-800