EFFECT OF ALLOY ADDITIONS ON ELECTROMIGRATION FAILURES IN THIN ALUMINUM FILMS

被引：34

作者：

GANGULEE, A

DHEURLE, FM

机构：

来源：

APPLIED PHYSICS LETTERS | 1971年 / 19卷 / 03期

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D O I：

10.1063/1.1653828

中图分类号：

O59 [应用物理学];

学科分类号：

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页码：76 / &

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