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INTERFACIAL REACTIONS BETWEEN ALUMINUM AND TRANSITION-METAL NITRIDE AND CARBIDE FILMS
被引:113
作者
:
WITTMER, M
论文数:
0
引用数:
0
h-index:
0
机构:
SWISS FED INST TECHNOL,CH-8092 ZURICH,SWITZERLAND
SWISS FED INST TECHNOL,CH-8092 ZURICH,SWITZERLAND
WITTMER, M
[
1
]
机构
:
[1]
SWISS FED INST TECHNOL,CH-8092 ZURICH,SWITZERLAND
来源
:
JOURNAL OF APPLIED PHYSICS
|
1982年
/ 53卷
/ 02期
关键词
:
D O I
:
10.1063/1.330509
中图分类号
:
O59 [应用物理学];
学科分类号
:
摘要
:
引用
收藏
页码:1007 / 1012
页数:6
相关论文
共 16 条
[1]
CHEUNG N, 1980, 1979 P S THIN FILM I
[2]
Chu WK., 1978, BACKSCATTERING SPECT
[3]
TIN AS A DIFFUSION BARRIER IN THE TI-PT-AU BEAM-LEAD METAL SYSTEM
GARCEAU, WJ
论文数:
0
引用数:
0
h-index:
0
机构:
BELL TEL LABS INC, ALLENTOWN, PA 18103 USA
GARCEAU, WJ
FOURNIER, PR
论文数:
0
引用数:
0
h-index:
0
机构:
BELL TEL LABS INC, ALLENTOWN, PA 18103 USA
FOURNIER, PR
HERB, GK
论文数:
0
引用数:
0
h-index:
0
机构:
BELL TEL LABS INC, ALLENTOWN, PA 18103 USA
HERB, GK
[J].
THIN SOLID FILMS,
1979,
60
(02)
: 237
-
247
[4]
METALLIZATION IN MICROELECTRONICS
GHATE, PB
论文数:
0
引用数:
0
h-index:
0
机构:
TEXAS INSTRUMENTS INC, SEMICOND RES & ENGN LABS, DALLAS, TX 75222 USA
TEXAS INSTRUMENTS INC, SEMICOND RES & ENGN LABS, DALLAS, TX 75222 USA
GHATE, PB
BLAIR, JC
论文数:
0
引用数:
0
h-index:
0
机构:
TEXAS INSTRUMENTS INC, SEMICOND RES & ENGN LABS, DALLAS, TX 75222 USA
TEXAS INSTRUMENTS INC, SEMICOND RES & ENGN LABS, DALLAS, TX 75222 USA
BLAIR, JC
FULLER, CR
论文数:
0
引用数:
0
h-index:
0
机构:
TEXAS INSTRUMENTS INC, SEMICOND RES & ENGN LABS, DALLAS, TX 75222 USA
TEXAS INSTRUMENTS INC, SEMICOND RES & ENGN LABS, DALLAS, TX 75222 USA
FULLER, CR
[J].
THIN SOLID FILMS,
1977,
45
(01)
: 69
-
84
[5]
APPLICATION OF TI-W BARRIER METALLIZATION FOR INTEGRATED-CIRCUITS
GHATE, PB
论文数:
0
引用数:
0
h-index:
0
GHATE, PB
BLAIR, JC
论文数:
0
引用数:
0
h-index:
0
BLAIR, JC
FULLER, CR
论文数:
0
引用数:
0
h-index:
0
FULLER, CR
MCGUIRE, GE
论文数:
0
引用数:
0
h-index:
0
MCGUIRE, GE
[J].
THIN SOLID FILMS,
1978,
53
(02)
: 117
-
128
[6]
ELECTRICAL AND MECHANICAL FEATURES OF PLATINUM SILICIDE-ALUMINUM REACTION
HOSACK, HH
论文数:
0
引用数:
0
h-index:
0
机构:
GE CO, SYRACUSE, NY 13201 USA
GE CO, SYRACUSE, NY 13201 USA
HOSACK, HH
[J].
JOURNAL OF APPLIED PHYSICS,
1973,
44
(08)
: 3476
-
3485
[7]
Kubaschewski O., 1967, METALLURGICAL THERMO
[8]
EVOLUTION AND CURRENT STATUS OF ALUMINUM METALLIZATION
LEARN, AJ
论文数:
0
引用数:
0
h-index:
0
机构:
FAIRCHILD CAMERA & INSTR CORP, RES & DEV LAB, PALO ALTO, CA 94304 USA
FAIRCHILD CAMERA & INSTR CORP, RES & DEV LAB, PALO ALTO, CA 94304 USA
LEARN, AJ
[J].
JOURNAL OF THE ELECTROCHEMICAL SOCIETY,
1976,
123
(06)
: 894
-
906
[9]
MAENPAA M, 1980, 1979 P S THIN FILM I
[10]
DIFFUSIVITY AND SOLUBILITY OF SI IN AL METALLIZATION OF INTEGRATED CIRCUITS
MCCALDIN, JO
论文数:
0
引用数:
0
h-index:
0
MCCALDIN, JO
SANKUR, H
论文数:
0
引用数:
0
h-index:
0
SANKUR, H
[J].
APPLIED PHYSICS LETTERS,
1971,
19
(12)
: 524
-
&
←
1
2
→
共 16 条
[1]
CHEUNG N, 1980, 1979 P S THIN FILM I
[2]
Chu WK., 1978, BACKSCATTERING SPECT
[3]
TIN AS A DIFFUSION BARRIER IN THE TI-PT-AU BEAM-LEAD METAL SYSTEM
GARCEAU, WJ
论文数:
0
引用数:
0
h-index:
0
机构:
BELL TEL LABS INC, ALLENTOWN, PA 18103 USA
GARCEAU, WJ
FOURNIER, PR
论文数:
0
引用数:
0
h-index:
0
机构:
BELL TEL LABS INC, ALLENTOWN, PA 18103 USA
FOURNIER, PR
HERB, GK
论文数:
0
引用数:
0
h-index:
0
机构:
BELL TEL LABS INC, ALLENTOWN, PA 18103 USA
HERB, GK
[J].
THIN SOLID FILMS,
1979,
60
(02)
: 237
-
247
[4]
METALLIZATION IN MICROELECTRONICS
GHATE, PB
论文数:
0
引用数:
0
h-index:
0
机构:
TEXAS INSTRUMENTS INC, SEMICOND RES & ENGN LABS, DALLAS, TX 75222 USA
TEXAS INSTRUMENTS INC, SEMICOND RES & ENGN LABS, DALLAS, TX 75222 USA
GHATE, PB
BLAIR, JC
论文数:
0
引用数:
0
h-index:
0
机构:
TEXAS INSTRUMENTS INC, SEMICOND RES & ENGN LABS, DALLAS, TX 75222 USA
TEXAS INSTRUMENTS INC, SEMICOND RES & ENGN LABS, DALLAS, TX 75222 USA
BLAIR, JC
FULLER, CR
论文数:
0
引用数:
0
h-index:
0
机构:
TEXAS INSTRUMENTS INC, SEMICOND RES & ENGN LABS, DALLAS, TX 75222 USA
TEXAS INSTRUMENTS INC, SEMICOND RES & ENGN LABS, DALLAS, TX 75222 USA
FULLER, CR
[J].
THIN SOLID FILMS,
1977,
45
(01)
: 69
-
84
[5]
APPLICATION OF TI-W BARRIER METALLIZATION FOR INTEGRATED-CIRCUITS
GHATE, PB
论文数:
0
引用数:
0
h-index:
0
GHATE, PB
BLAIR, JC
论文数:
0
引用数:
0
h-index:
0
BLAIR, JC
FULLER, CR
论文数:
0
引用数:
0
h-index:
0
FULLER, CR
MCGUIRE, GE
论文数:
0
引用数:
0
h-index:
0
MCGUIRE, GE
[J].
THIN SOLID FILMS,
1978,
53
(02)
: 117
-
128
[6]
ELECTRICAL AND MECHANICAL FEATURES OF PLATINUM SILICIDE-ALUMINUM REACTION
HOSACK, HH
论文数:
0
引用数:
0
h-index:
0
机构:
GE CO, SYRACUSE, NY 13201 USA
GE CO, SYRACUSE, NY 13201 USA
HOSACK, HH
[J].
JOURNAL OF APPLIED PHYSICS,
1973,
44
(08)
: 3476
-
3485
[7]
Kubaschewski O., 1967, METALLURGICAL THERMO
[8]
EVOLUTION AND CURRENT STATUS OF ALUMINUM METALLIZATION
LEARN, AJ
论文数:
0
引用数:
0
h-index:
0
机构:
FAIRCHILD CAMERA & INSTR CORP, RES & DEV LAB, PALO ALTO, CA 94304 USA
FAIRCHILD CAMERA & INSTR CORP, RES & DEV LAB, PALO ALTO, CA 94304 USA
LEARN, AJ
[J].
JOURNAL OF THE ELECTROCHEMICAL SOCIETY,
1976,
123
(06)
: 894
-
906
[9]
MAENPAA M, 1980, 1979 P S THIN FILM I
[10]
DIFFUSIVITY AND SOLUBILITY OF SI IN AL METALLIZATION OF INTEGRATED CIRCUITS
MCCALDIN, JO
论文数:
0
引用数:
0
h-index:
0
MCCALDIN, JO
SANKUR, H
论文数:
0
引用数:
0
h-index:
0
SANKUR, H
[J].
APPLIED PHYSICS LETTERS,
1971,
19
(12)
: 524
-
&
←
1
2
→