Particle behavior in an electron cyclotron resonance plasma etch tool

Sources of particles in a closed-coupled electron cyclotron resonance plasma source used for polysilicon etch included flaking of a residual film deposited on chamber surfaces and shedding of material from the electrostatic wafer chuck. A large. episodic increase in the number of particles added to a wafer in a clean system is observed more frequently for a plasma-on than for a gas-only source condition. For film-forming process conditions, particles were added to wafers by a residual film, which was observed to fracture and flake away from chamber surfaces. The presence of a plasma, especially when radiofrequency bias is applied to the wafer, caused more particles to be ejected from the walls and added to wafers than the microwave powers. A study of the effect of electrode temperatures on particles added showed that thermophoretic and gravitational forces are not significant for this electron cyclotron resonance operating configuration. Particles originating from the electrostatic chuck were observed to be deposited on wafers in much larger numbers in the presence of the plasma as compared with gas-only conditions, implying the existence of a large ion drag force.