DAMAGE DEPTH PROFILES IN ION-IMPLANTED SILICON BY THE PHOTOACOUSTIC DISPLACEMENT TECHNIQUE

被引:8
作者
HARA, T
MURAKI, T
SAKURAI, M
TAKEDA, S
机构
[1] Electrical Engineering, Hosei University, Koganei Tokyo
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1993年 / 32卷 / 6A期
关键词
ION IMPLANTATION; DAMAGE; DEPTH PROFILE; PHOTOACOUSTIC EFFECT; DAMAGE MEASUREMENT;
D O I
10.1143/JJAP.32.2577
中图分类号
O59 [应用物理学];
学科分类号
摘要
Damage density measurement for ion-implanted silicon is studied, where the density is measured using Rutherford backscattering spectrometry (RBS) and a newly developed photoacoustic displacement (PAD) technique. Since correlation is obtained between the observed PAD and quantitative damage density in ion-implanted silicon at 150 keV at a dose of 2.0 X 10(15) ions/cm2, damage density can be determined quantitatively from the PAD measurement at the surface. A damage density depth profile can also be obtained using the differential PAD measurement. The observed profile agrees well with the ones of the displaced atom density obtained by RBS measurement and Monte Carlo simulation.
引用
收藏
页码:2577 / 2581
页数:5
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