PHYSICAL LIMITS TO THE USEFUL PACKAGING DENSITY OF ELECTRONIC SYSTEMS

被引：9

作者：

PEASE, RF

KWON, OK

机构：

[1] STANFORD UNIV, DEPT ELECT ENGN, STANFORD, CA 94305 USA

[2] TEXAS INSTRUMENTS INC, CORP RES & DEV, DALLAS, TX 75265 USA

来源：

IBM JOURNAL OF RESEARCH AND DEVELOPMENT | 1988年 / 32卷 / 05期

关键词：

D O I：

10.1147/rd.325.0636

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

引用

页码：636 / 646

页数：11

共 28 条

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